Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Simulation Technologies of Electronics Packaging
Investigation of Heat Conduction Analysis in 3D Integration Packaging for Practical-scale Quantum Annealing Machines
Wei Feng, Katsuya Kikuchi
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2022 Volume 25 Issue 6 Pages 589-593

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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