Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Advanced Studies on Electronics Components and Electronics Packaging Technologies in Academia
Sintered Bonding Process Using Sheet-Like Insert Materials
Hiroshi Nishikawa
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2022 Volume 25 Issue 7 Pages 685-690

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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