Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Electronics Packaging Technology: The Current Status and Perspective
Technological Trends in High-Frequency Low-Loss Printed Wiring Board Materials for Information and Communication Systems
[in Japanese]
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2023 Volume 26 Issue 1 Pages 2-9

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