Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
Development of Test Head Type Thermal Resistance Measurement System for Small Electronic Devices and Materials
Hirotoshi AokiKazuyoshi FushinobuToshio Tomimura
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2023 Volume 26 Issue 1 Pages 117-124

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Abstract

In the thermal design of electronic devices, it is necessary to estimate the temperature of the small electronic components used and examine the properness of the temperature. The temperature of a component is mostly influenced by two thermal resistances: that of the electronic component as determined by the thermal conductivity of the material, and that of the path between the mounting area and the air. Therefore, development of an evaluation apparatus for measuring these parameters is urgently required.

In this study, a test-head type thermal resistance measurement system for estimating the above-mentioned thermal resistances was developed. The measurement area of the system is 2 mm square, and the measurement range of thermal resistance is from 10.1 to 299.5 K/W. This paper discusses the validity of the measurement principle of the system and the verification results of the measurement accuracy.

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© 2023 The Japan Institute of Electronics Packaging
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