Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Japanese Microelectronics Packaging Engineers Working Abroad
Features of Packaging Technology of IGBT Modules Applied to Renewable Energy and New Energy Vehicles in the Chinese Market
Kenichiroh Sato
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2023 Volume 26 Issue 6 Pages 526-529

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© 2023 The Japan Institute of Electronics Packaging
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