Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Japanese Microelectronics Packaging Engineers Working Abroad
What I Think after 25 Years of Working for an American Semiconductor Company
Tadashi Kamewada
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2023 Volume 26 Issue 6 Pages 544-550

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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