Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Electronics Packaging Technology: The Current Status and Perspective
From 2D to 3D, “Chiplet Integration” Enabling the “More Moore” Trend
[in Japanese]
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2024 Volume 27 Issue 1 Pages 59-70

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