Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trend of AI in Intelligent Electronics Packaging
Automation of Component Placement and Pattern Routing in Printed Circuit Board Artwork Design
Takeshi Hojo
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2024 Volume 27 Issue 3 Pages 214-219

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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