Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Electronic Components and Interconnection Technologies Supporting the Advancement of Electronic Devices
Sn-Sb-Ag Solder Alloy which Achieves High-Temperature Operation and High Reliability of Power Semiconductors
Kohei Mitsui , Hirohiko Watanabe, Jantanee Tungbanjerdwanid, Ikuo Shohji
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2025 Volume 28 Issue 3 Pages 214-217

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
Proceedings of JIEP Annual Meeting
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