Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Latest Trends and Environment in the Semiconductor Field Driven by Electronics Packaging Technology
Present and Future of Semiconductor Industry Driven by Electronics Packaging Technology: Fine Wiring Technologies Required for 2.xD Integration
Hidetoshi Yugawa
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2025 Volume 28 Issue 6 Pages 516-522

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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