Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection

Abstract

In-circuit testing using a flying probe tester is an innovative testing technology that addresses the limitations of conventional bed-of-nails fixtures, including high design workload, significant running costs, and difficulties in accessing fine-pitch components and high-density traces. By using ultra-high-speed probes that can contact any point on a printed circuit board assembly (PCBA) with micron-level precision, it establishes a new testing standard for high-density PCBAs that are difficult to test using traditional approaches.

The latest model integrates support for JTAG (Joint Test Action Group) testing and incorporates ZERO Impact technology, positioning it as a next-generation standard in PCBA testing.