Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / The Role and Evolution of Optical Packaging Technology in Scale-up/out Networks for AI Clusters
Trends, Predictions, and Challenges about Materials for Photonic Integrated Circuits (PIC) Packaging & Technology for Passive Optical Components
Hideyuki Nawata
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2026 Volume 29 Issue 3 Pages 197-202

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