Abstract
Now a days many PCB companies are trying to improve “build up” technology not only for PCBs but also for packaging technology. Today photo via by photo solder resist method is the most popular for producing IVH, but the characteristics needed for insulation layers, for example high Tg and low dielectric constant, are very demanding and Photo Via cannot meet these high performance needs. To meet these needs, non-photosensitive insulation resin can improve the characteristics easily. Therefore, the industry is now looking at LASER DRILLING as alternate IVH production technology. TOK (TOKYO OHKA KOGYO CO., LTD.) has developed another new IVH manufacturing method that uses sandblasting to etch the insulation layer. This method is called the “SB-Via PROCESS”. We have developed a special dry film, “ORDYL-SV”, and a special non-photosensitive insulation resin, “SV-R RESIN”, and we have designed the equipment for this process.
