Abstract
A novel high-frequency MCM with a resin-molded faced-up structure and its fabrication technology based on a composite deep etching and micro-press technology are proposed for the process simplification, reverse side electrode configuration and the warp reduction of Cu substrate. The advantage of this novel technology is confirmed by various test fabrication of MCM substrates with the novel structure. By the introduction of the composite deep etching and micro-press technologies, the following results are achieved: (1) the processing time reduction by a factor of 1/2 and the implementation of lead-less electrode structure, (2) the realization of very thin MCM with less than 0.5-mm thickness. Also, it is shown that the applications of“#”shaped-wall structure separating between modules and a mechanical reformation technique are very useful for the warp suppression of Cu substrates. Reduction of the warp of Cu substrate by less than 30μm is achieved.
