抄録
This paper reviews a new packaging technique using Lead-less Super Broadband (LSuB) carrier for high-speed IC module. The LSuB carrier drastically reduces the parasitic inductive elements of the interconnection between IC and package terminals, and provides an impedance matched interconnection. The LSuB carrier realized the insertion loss of less than 1.3 dB from DC to 50 GHz. The fabricated package module using the LSuB carrier achieved a 3-dB bandwidth of more over 40 GHz.
