2007 Volume 10 Issue 2 Pages 135-139
The demand for high performance and the downsizing of electronic devices in recent years mean that management of heat from electronic components has become a big problem. Heat radiation efficiency has been improved by attaching aluminum on the printed circuit boards through the insulating resin. The insulating resin has generally been attached after roughing the aluminum. However, this has led to delamination of the resin during heat-treatment and machining because of the lack of bonding strength between the aluminum and resin. In an attempt to obtain strong adhesion between the aluminum and insulating resin, this study examined a new method of modifying the aluminum surface. With the introduction of optimum conditions, adhesion strength about ten times higher than the conventional method was obtained, and the PCBs showed excellent machine impact properties.
