抄録
We developed a new catalyst of silver, and examined the characteristics. The silver catalyst was synthesized without expensive palladium and without tin which becomes a catalytic poison. Therefore, the silver catalyst had various characteristics which are different from usual Pd-Sn catalyst. As applying the silver catalyst to the printed circuit board, the superiority of this catalyst became conspicuous. The adsorption-ability and the electroless copper plating deposition-ability of this catalyst were almost equal to those of Pd-Sn catalyst. Moreover, it was proved that most of the adsorbed silver catalyst dissolved in the copper foil etching process during circuit forming of the printed circuit board. As a result, the decrease in the insulation resistance value between the circuits and the deposition over the areas on which no deposition is required (the bridge and so on) can be prevented by using the silver catalyst.
