Abstract
The warp deformation behavior due to cooling in flip chip attached laminated beams constructed with a LSI chip, an anisotropic conductive film layer and a glass-epoxy resin substrate was calculated by using the thermo-viscoelastic analysis method and elastic analysis method. Although calculated values by elastic analysis method and experimental values were not in accord, the calculated values by thermo-viscoelastic analysis method shows good relationship to the experimental values. It is necessary to use the thermo-viscoelastic analysis method to get the optimum design for not only material properties but constructive layered material to achieve the higher reliable electronics devices.
