Build-up Substrate Technology Use in Semiconductor Packages

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Build-up Substrate Technology Use in Semiconductor Packages

Burton CARPENTER, Masahiro TSURIYA

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JOURNAL FREE ACCESS

1999 Volume 2 Issue 6 Pages 500-502

DOI https://doi.org/10.5104/jiep.2.500

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[in Japanese]

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© The Japan Institute of Electronics Packaging

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