Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
Build-up Substrate Technology Use in Semiconductor Packages
Burton CARPENTER, Masahiro TSURIYA
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Volume 2 (1999) Issue 6 Pages 500-502

DOI https://doi.org/10.5104/jiep.2.500
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