Sn-Ag系無鉛はんだの諸特性に及ぼすCu添加の影響

抄録

Effect of Cu addition on melting point, microstructure, wettability and peel strength between Sn-3.5mass%Ag solder and Au coated leadframe has been examined. The melting point was decreased to 218°C by Cu addition. Large Cu₆Sn₅ was preticipated in solders at 1.5mass% Cu addition. Wettability was good at 0.5mass% Cu addition. Peel strength was improved by 1.5mass% Cu addition due to the decrease in AuSn₄ in the solder.