Subject of Lead Free Solder: Electrical & Mechanical Reliability

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Subject of Lead Free Solder: Electrical & Mechanical Reliability

Tsutomu TSUKUI

Author information

JOURNAL FREE ACCESS

2000 Volume 3 Issue 5 Pages 450-453

DOI https://doi.org/10.5104/jiep.3.450

Details

Article 1st page

Content from these authors

© The Japan Institute of Electronics Packaging

Favorites & Alerts

Related articles

Recently viewed articles

A case of loxoprofen sodium-induced eosinophilic pneumonia that occurred ipsilaterally after VATS lobectomy for lung cancer
On the Activities of Soto Monks in the Latter Middle Ages
Chromosome Mapping of Mammalian DNA Repair Genes
PERFORMANCE EVALUATION OF GROUND MOTION PREDICTION EQUATIONS FOR ABSOLUTE VELOCITY RESPONSE SPECTRA (1-10 S) IN JAPAN FOR AN EARTHQUAKE EARLY WARNING
Study on Laser Micro Machining Using a Photonic Nanojet (1st report) —Fundamental Characteristics of Laser Micro Machining Using a Photonic Nanojet—

Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

Top