Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Suppression of High Frequency Current on Power Plane of PCB by EMI Reduction LSI Package
Yukihiro FUKUMOTOTetsuyoshi OGURAOsami WADARyuji KOGA
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JOURNAL FREE ACCESS

2000 Volume 3 Issue 6 Pages 515-522

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Abstract
High frequency currents on power/ground planes of a digital printed circuit board generate a great amount of electromagnetic noise. On digital printed circuit boards, power and ground planes are used not only for supply of DC power to LSI, but also for return path of high frequency signal current. This paper describes an LSI package that has a decoupling inductor which blocks out high frequency currents, and a bypass capacitor which supplies high frequency currents to the LSI. Electromagnetic radiation noise from the board is reduced significantly by suppressing high frequency currents on power/ground terminals of the LSI package. Furthermore, the relationship between value of the decoupling inductor and the effect of noise reduction is verified theoretically and experimentally.
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