Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Thermal Fatigue Reliability Estimation for Underfill Assembly Using SDSS and FEA
Yasuhisa KAGAQiang YUMasaki SHIRATORI
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2000 Volume 3 Issue 7 Pages 585-591

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Abstract
Recently, the underfill mount structure is noticed. However, the sufficient thermal fatigue reliability evaluation has not been established. In this study, the authors proposed a simple reliability evaluation method using Finite Element Analysis (FEA) . In addition, an approximate calculating method for the reliability evaluation parameter (Total equivalent inelastic strain range) was developed using Statistical Design Support System (SDSS) .
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