Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Current Status and Trend of Epoxy Resins for Printed Circuit Board
Masakazu YOSHIZAWA
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2001 Volume 4 Issue 2 Pages 102-107

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals
Transactions of The Japan Institute of Electronics Packaging
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