Reliability Analysis for Underfill-Encapsulated Flip Chip Packages (Direct Attach Aurum Bump Type)

Abstract

Thermal fatigue life of Flip Chip packages (Direct Attach Aurum bump type) is studied both analytically and experimentally. In this analysis we found the law of thermal fatigue life which is ruled by equivalent-stress of aurum bump and clarified a sensitivity of thermal fatigue life related to material and structural size.