Abstract
We investigated the influence of organic nitrogen compounds (leveler) as additive for acid copper plating for via-filling. By applying of Cyclic Voltammetric Stripping (CVS), we confirmed the effect of leveler to copper electrodeposition. The leveler which is effective to via-filling inhibits electrodeposition with an increase in rotation speed of rotating disk electrode, and the effect to suppress electrodeposition is controlled by thickness of diffusion layer. Therefore, the electrodeposition at via outside having thin diffusion layer is suppressed and preferentially fill the via bottom. However, many levelers influence to film properties. Cationic dye decreases elongation and thiourea derivative increases internal stress. By selecting proper levelers (polyamine derivative), we could gain the additive having excellent via-filling effect and film properties.
