Technology of Ultra-Thin Fine Pitch LGA

Takashi SUGATA; Yosikazu KUMAGAYA; Tadashi UNO; Akira TAKASHIMA; Seiichi ORIMO; Kouji INOUE; Mitsuru SATOU

doi:10.5104/jiep.5.278

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Technology of Ultra-Thin Fine Pitch LGA

Takashi SUGATA, Yosikazu KUMAGAYA, Tadashi UNO, Akira TAKASHIMA, Seiichi ORIMO, Kouji INOUE, Mitsuru SATOU

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Keywords: Thickness, Card, FLGA, Packaging-Technology, Board, Plating

JOURNAL FREE ACCESS

2002 Volume 5 Issue 3 Pages 278-282

DOI https://doi.org/10.5104/jiep.5.278

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Abstract

Recently, demands for card-type Products has be growing. So, package is demanded not only to be smaller and lighter. But also its thickness is needed to be extremely thin. We have developed an ultra-thin package (0.5h-FLGA) with a package thickness of 0.5mm (Max) . The technical features and characteristics are described in this paper.

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