Thermo-Viscoelastic Analysis of Thermal Residual Stress and Deformation Influenced by Loaded Temperature for Constitutive Materials in Electronic Devices

Abstract

Thermal residual stress and warp deformation behavior generate in an electronic device composed of LSI chip and adhesive, FR-4 substrate were analyzed, using the numerical simulation method based on the linear vscoelastic theory. The interfacial thermal stress and warp deformation of laminated beam composed of LSI chip and adhesive are larger than that of LSI chip and FR-4 substrate. It was clarified that thermal residual stress and warp deformation generate in an electronic device are strongly influenced by the loaded temperature conditions as well as material properties.