Abstract
Interfacial reaction between Sn-8Zn-3Bi solder and Cu pad has a significant effect on reliability of solder joints. However the effect of plating materials for Cu lead on the interfacial reaction behavior has not been cleared. In the present study, to clarifying this, Ag, Bi, Cu or Pb, which was the element of lead free plating for Cu lead, was added to Sn-8Zn-3Bi solder. These solders were reflowed on Cu substrate with varying reflow time and temperature. The reaction layer between solder and Cu, and the growth kinetics of the reaction layer were investigated both during the reflow processes and after high temperature exposure tests. The growth of the interfacial reaction layer using Ag added Sn-8Zn-3Bi solder was suppressed compared with the others solders.
