Research and Development of Optoelectronic Modules for Chip-to-Chip and Board Level Optical Interconnects

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Research and Development of Optoelectronic Modules for Chip-to-Chip and Board Level Optical Interconnects

Takashi MIKAWA, Seiki HIRAMATSU, Hideto FURUYAMA, Masao KINOSHITA, Osamu IBARAGI

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JOURNAL FREE ACCESS

2004 Volume 7 Issue 3 Pages 223-228

DOI https://doi.org/10.5104/jiep.7.223

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© The Japan Institute of Electronics Packaging

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Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging

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