Optimum Design of Layer Construction and Properties with Thermo-Viscoelastic Stress Analysis in New BOC Package

Abstract

Thermal residual stress and warp deformation behavior which generate in new BOC package were analyzed, concerning with material thickness and material properties, using the numerical simulation method based on the linear viscoelastic theory. It was clarified that the interfacial thermal residual stress and warp deformation are strongly influenced by not only material thickness but also the modulus of the film, and that the reliability of BOC package can make equal to that of μ-BGA package, if the properties designs such as material thickness and material properties in BOC package could be achieved.