State of the Art and New Trend of Assessment for Reliability Analysis Technologies

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

State of the Art and New Trend of Assessment for Reliability Analysis Technologies

[in Japanese]

Author information

JOURNAL FREE ACCESS

2006 Volume 9 Issue 1 Pages 20-23

DOI https://doi.org/10.5104/jiep.9.20

Details

Article 1st page

Content from these authors

© The Japan Institute of Electronics Packaging

Favorites & Alerts

Related articles

Recently viewed articles

Learning Effectiveness of Computational Thinking in a Simple Classification Task While Using a Yes/No Chart Learning System Compared to Using a Visual Programming Learning System
28aGS-6 Development of interferometer module for DECIGO pathfinder II
急速充電所における混雑の実態と充電器増設の効果
[title in Japanese]
High qnrS retention of ESBL-producing and mcr-harbouring colistin-resistant Escherichia coli in Vietnamese food products

Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

Top