The requirements for the quality of ultra pure water (UPW) used in the semiconductor industry and the grounds for criteria for respective quality parameters are summarized. Examples of the UPW systems are shown, and how the ion exchange resins (IER) are used in such systems is described with relation to particles, TOC (Total Organic Carbon), resistivity, and dissolved oxygen of the UPW.
It is possible to reduce the particle throw from IER by proper pre-conditioning. Reducing TOC in UPW calls for minimining organic leachables from IER. In the way of maintaining a high resistivity of UPW, the optimum pretreatment (coagulaion) and employing reverse osmosois membrane are effective. When the catalytic resins are used to reduce dissolved oxygen, it is necessary to collect more data on the trace metal leachable from the catalytic resins.
In the future UPW production systems, IER must be “ultra”-cleaned, especially with regard to TOC.
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