Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

3,797 registered articles
(updated on July 25, 2025)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNAL PEER REVIEWED PARTIALLY RESTRICTED ACCESS ADVANCE PUBLICATION
Scopus

2025 Volume 28 Issue 4

Trend of Thermal Management Technology for Electric Vehicles Masanari Numata
2025 JIEP Award
Contents (in English)
Introduction to the Special Edition Yuichi Takeda

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Most viewed articles (June 2025)

1

Fundamentals of Thermosetting Resins

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
2

The Status and Trend of Inter Layer Insulating Materials for Semiconductor Packages

Released on J-STAGE: February 24, 2012 | Volume 14 Issue 5 Pages 398-403

Hirohisa Narahashi, Shigeo Nakamura
3

Structure-Property Relationship in Polyimides

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 7 Pages 640-646

Yoshio IMAI
4

Fault and Acceleration Test

Released on J-STAGE: July 01, 2018 | Volume 21 Issue 4 Pages 277-280

Hidetaka Okamoto
5

The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration

Released on J-STAGE: August 01, 2019 | Volume 22 Issue 5 Pages 361-366

Osamu Shimada

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Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

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