Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

3,927 registered articles
(updated on April 10, 2026)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNAL PEER REVIEWED PARTIALLY RESTRICTED ACCESS ADVANCE PUBLICATION
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2026 Volume 29 Issue 2

Introduction to the Special Edition Kengo Iokibe
Demonstration of Mode-Division-Multiplex-Transmission Using an Analog Front-End LSI Tohlu Matsushima, Takefumi Yoshikawa, Yuki Fukumoto
Contents
Establishment of Rules for the Next Generation Regarding the Operation of the Society Shinichi Endo

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Most viewed articles (March 2026)

1

The Status and Trend of Inter Layer Insulating Materials for Semiconductor Packages

Released on J-STAGE: February 24, 2012 | Volume 14 Issue 5 Pages 398-403

Hirohisa Narahashi, Shigeo Nakamura
2

Fundamentals of Thermosetting Resins

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
3

Structure-Property Relationship in Polyimides

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 7 Pages 640-646

Yoshio IMAI
4

Latest Trends of Polymer Waveguide Material for Co-Packaged Optics

Released on J-STAGE: March 01, 2022 | Volume 25 Issue 2 Pages 152-156

Hideyuki Nawata
5

Prediction of Thermal Contact Resistance for Thermal Design of Electronics

Released on J-STAGE: March 01, 2021 | Volume 24 Issue 2 Pages 174-177

Tomoyuki Hatakeyama, Risako Kibushi, Yoshiki Hyodo, Masaru Ishizuka

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Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

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