Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

2,715 registered articles
(updated on April 25, 2019)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNALS PEER REVIEWED RESTRICTED ACCESS

2019 Volume 22 Issue 2

News
Instruction for Authors
Large Area Nanoimprinting and Its Applications Akihiro Miyauchi
Mold Design and Process for Application of Nanoimprint Lithography to Interconnections Sung-Won Youn, Kenta Suzuki, Hiroshi Hiroshima

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Most viewed articles Mar.2019

1

Fundamentals of Thermosetting Resins

Released: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
2

Fundamentals of Wire Bonding Technology for Semiconductor Devices

Released: March 18, 2010 | Volume 5 Issue 4 Pages 412-417

Jin OHNUKI
3

Structure-Property Relationship in Polyimides

Released: March 18, 2010 | Volume 4 Issue 7 Pages 640-646

Yoshio IMAI
4

Actual Conditions and Challenges of Accelerated Test

Released: August 03, 2011 | Volume 13 Issue 7 Pages 502-506

Hirokazu Tanaka
5

Evaluation of Accelerated Life Testing by HAST

Released: March 18, 2010 | Volume 6 Issue 7 Pages 540-545

Kazuhiro NAKAMURA

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Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

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