Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

3,948 registered articles
(updated on May 28, 2026)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNAL PEER REVIEWED PARTIALLY RESTRICTED ACCESS ADVANCE PUBLICATION
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2026 Volume 29 Issue 3

High Productivity and Fine Electrode Pitch Die-to-Die Connection Technology for Pillar-Suspended Bridge (PSB) Chiplet Integration Technology Ichiro Kono, Yoichiro Kurita
Introduction to the Special Edition Yasunobu Matsuoka
Toward Photonics-Electronics Convergence Koichi Takemura
Advances and Challenges in High-Speed Optical Device Technologies Shigeru Kanazawa

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Most viewed articles (April 2026)

1

The Status and Trend of Inter Layer Insulating Materials for Semiconductor Packages

Released on J-STAGE: February 24, 2012 | Volume 14 Issue 5 Pages 398-403

Hirohisa Narahashi, Shigeo Nakamura
2

Fundamentals of Thermosetting Resins

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
3

Structure-Property Relationship in Polyimides

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 7 Pages 640-646

Yoshio IMAI
4

Latest Trends of Polymer Waveguide Material for Co-Packaged Optics

Released on J-STAGE: March 01, 2022 | Volume 25 Issue 2 Pages 152-156

Hideyuki Nawata
5

Stress Analysis of Underfill in Advanced Semiconductor Package Structures

Released on J-STAGE: September 01, 2022 | Volume 25 Issue 6 Pages 561-568

Osamu Suzuki

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Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

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