Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

3,822 registered articles
(updated on August 17, 2025)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNAL PEER REVIEWED PARTIALLY RESTRICTED ACCESS ADVANCE PUBLICATION
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2025 Volume 28 Issue 5

Instruction for Authors
A Study on the Measurement of Contact Thermal Resistance for Thermal Interface Material Masakazu Hattori
Thermal Design Method Using Heat Dissipation to the Printed Circuit Board for Small Surface Mount Components for Electronic Devices Yoshinori Aruga
Cooling Technology for High Heating Electronics Using Vapor Chamber Harutoshi Hagino

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Most viewed articles (July 2025)

1

The Status and Trend of Inter Layer Insulating Materials for Semiconductor Packages

Released on J-STAGE: February 24, 2012 | Volume 14 Issue 5 Pages 398-403

Hirohisa Narahashi, Shigeo Nakamura
2

Fundamentals of Thermosetting Resins

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
3

Structure-Property Relationship in Polyimides

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 7 Pages 640-646

Yoshio IMAI
4

The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration

Released on J-STAGE: August 01, 2019 | Volume 22 Issue 5 Pages 361-366

Osamu Shimada
5

Fault and Acceleration Test

Released on J-STAGE: July 01, 2018 | Volume 21 Issue 4 Pages 277-280

Hidetaka Okamoto

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Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

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