Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

3,877 registered articles
(updated on December 28, 2025)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNAL PEER REVIEWED PARTIALLY RESTRICTED ACCESS ADVANCE PUBLICATION
Scopus

2025 Volume 28 Issue 7

[title in Japanese]
Future Perspectives on Next-Generation Healthcare Electronics Seiichi Takamatsu
Implantable Wireless Devices for Cancer Therapy Kento Yamagishi, Masato Saito, Michinao Hashimoto, Toshinori Fujie, Yuji Morimoto
Kameda & Miyake Laboratory, Big Data Science Research Field, Research Institute for Semiconductor Engineering (RISE), Hiroshima University Suguru Kameda

View all articles in current issue

Most viewed articles (November 2025)

1

The Status and Trend of Inter Layer Insulating Materials for Semiconductor Packages

Released on J-STAGE: February 24, 2012 | Volume 14 Issue 5 Pages 398-403

Hirohisa Narahashi, Shigeo Nakamura
2

Fundamentals of Thermosetting Resins

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
3

The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration

Released on J-STAGE: August 01, 2019 | Volume 22 Issue 5 Pages 361-366

Osamu Shimada
4

Structure-Property Relationship in Polyimides

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 7 Pages 640-646

Yoshio IMAI
5

Latest Trends of Polymer Waveguide Material for Co-Packaged Optics

Released on J-STAGE: March 01, 2022 | Volume 25 Issue 2 Pages 152-156

Hideyuki Nawata

Favorites & Alerts

Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

Top