Proceedings of Microelectronics Symposium

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MES2012

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MES2012

A study of MEMS thin film cracking during humidity test

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 183-186
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_183

CONFERENCE PROCEEDINGS FREE ACCESS

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The safety and evaluation test of Lithium-Ion Secondary Battery

[in Japanese], [in Japanese], [in Japanese]

Pages 187-190
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_187

CONFERENCE PROCEEDINGS FREE ACCESS

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Evaluation of Threshold Current Density of Electromigration Damage in Via-connected Lines with Reservoir Structure by Numerical Simulation

[in Japanese], [in Japanese], [in Japanese]

Pages 191-194
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_191

CONFERENCE PROCEEDINGS FREE ACCESS

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A study about the defect detection system with capacitance to occur in the neighborhood of the printed wiring

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 195-198
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_195

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Application of TDR method to the failure analysis of TSV

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 199-202
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_199

CONFERENCE PROCEEDINGS FREE ACCESS

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Evaluation of the Oxide Thickness of Solder Bump via SERA and the Bondability of Solder Bump via Bump Fusion Test

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 203-206
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_203

CONFERENCE PROCEEDINGS FREE ACCESS

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Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Flipchip Solder Joints by Synchrotron Radiation X-Ray Laminography

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 207-210
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_207

CONFERENCE PROCEEDINGS FREE ACCESS

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Evaluation of Dielectric Properties of PWB Materials in the Millimeter Wave Band

[in Japanese], [in Japanese], [in Japanese]

Pages 211-212
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_211

CONFERENCE PROCEEDINGS FREE ACCESS

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A study on differential mode transmission characteristics of twisted wire pair

[in Japanese], [in Japanese], [in Japanese]

Pages 213-216
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_213

CONFERENCE PROCEEDINGS FREE ACCESS

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ESD Simulation for PWB

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 217-220
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_217

CONFERENCE PROCEEDINGS FREE ACCESS

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Resister for dumping resonance between power and ground plane of PCB

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 221-224
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_221

CONFERENCE PROCEEDINGS FREE ACCESS

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Investigation of Coupling Factor between Spiral Coils Formed on a PCB for Wireless Power Transfer

[in Japanese], [in Japanese], [in Japanese]

Pages 225-228
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_225

CONFERENCE PROCEEDINGS FREE ACCESS

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Wideband antenna with a slit considering build into housing wall of electronicc equipment

[in Japanese], [in Japanese], [in Japanese]

Pages 229-232
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_229

CONFERENCE PROCEEDINGS FREE ACCESS

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Basic Study on Building a bent UWB Antenna with Half-semicircular and Trapezoidal Elements into Electronic Equipment

[in Japanese], [in Japanese], [in Japanese]

Pages 233-236
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_233

CONFERENCE PROCEEDINGS FREE ACCESS

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Body Area Communication Using Electromagnetic Resonance Coupling

[in Japanese], [in Japanese], [in Japanese]

Pages 237-240
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_237

CONFERENCE PROCEEDINGS FREE ACCESS

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Transmission Characteristics of Body Area Communication Using Electromagnetic Resonance Coupling

[in Japanese], [in Japanese], [in Japanese]

Pages 241-244
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_241

CONFERENCE PROCEEDINGS FREE ACCESS

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Experimental Measurement of Small Signals By the New Type Sensor for Intrabody Communication

[in Japanese], [in Japanese], [in Japanese]

Pages 245-248
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_245

CONFERENCE PROCEEDINGS FREE ACCESS

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The next generation type Acid Copper Plating Additive which attains enhancement of productivity

[in Japanese]

Pages 249-250
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_249

CONFERENCE PROCEEDINGS FREE ACCESS

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Application of water‐soluble polymer to via filling

[in Japanese], [in Japanese]

Pages 251-252
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_251

CONFERENCE PROCEEDINGS FREE ACCESS

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Laminated Structure of LED Lighting System ～TOP MRS PROCESS～

[in Japanese]

Pages 253-254
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_253

CONFERENCE PROCEEDINGS FREE ACCESS

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FIB/TEMAnalysis of Joints on Printed Circuit Board

[in Japanese], [in Japanese], [in Japanese]

Pages 255-256
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_255

CONFERENCE PROCEEDINGS FREE ACCESS

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The low temperature and the short-time hardening adhesives for electronic device mounting

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 257-258
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_257

CONFERENCE PROCEEDINGS FREE ACCESS

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Electroless Copper Plating Process for Isolated Circuits OIC process

[in Japanese]

Pages 259-260
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_259

CONFERENCE PROCEEDINGS FREE ACCESS

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Single nozzle head for ink-jet process development

[in Japanese]

Pages 261-262
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_261

CONFERENCE PROCEEDINGS FREE ACCESS

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Development of High-Corrosion Resistance Electroless Nickel Plating Solution

[in Japanese], [in Japanese], [in Japanese]

Pages 263-264
Published: 2012
Released on J-STAGE: August 12, 2020

DOIhttps://doi.org/10.11486/mes.22.0_263

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (840K)

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