Proceedings of Microelectronics Symposium

All issues

MES2018

Displaying 51-100 of 100 articles from this issue

Download citation

Show all abstracts

MES2018

High Heat Resistant Encapsulation with Insulation Coating Using Electrospray Method

[in Japanese], [in Japanese], [in Japanese]

Pages 221-224
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_221

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (808K)
Reliability of nano-Cu sintered joint in nitrogen without pressure

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 225-228
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_225

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (699K)
Reliability Evaluation of Sintered Metal Bonding

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 229-232
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_229

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (628K)
Zn Mixing into Cu Nanoparticle/Bi-Sn Alloy Hybrid Joint

[in Japanese], [in Japanese]

Pages 233-236
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_233

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (901K)
Die-attach Technologies of Power Modules by Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 237-240
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_237

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1018K)
Effect of Heat Treatment of Gold Substrate on Sintered Silver

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 241-244
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_241

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (449K)
Sinter Joining by Ag Nanoparticles Paste using Positioning Die with Low Pressure and Their Shear Strength and Tensile Strength

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 245-248
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_245

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (515K)
In-situ Measurement of Shrinkage Behavior in Sintered Silver Nanoparticles Bonding Process

[in Japanese], [in Japanese], [in Japanese]

Pages 249-252
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_249

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (928K)
Development of bonding technology centering on aluminum by new silver nano-particle paste

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 253-256
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_253

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (816K)
Evaluation of Sintering Behavior of Ag Micron Flake

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 257-260
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_257

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1494K)
Improvement of electrical properties of pressure-less sintering using multi-modal micron and submicron Ag particles

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 261-264
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_261

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (430K)
Robust Hybrid Bonding at Low Temperature and Armospheric Pressure

[in Japanese], [in Japanese], [in Japanese]

Pages 265-268
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_265

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (3227K)
Analysis of Interface Structure Formation and Electrical Conductivity Development in Electrically Conductive Adhesives

[in Japanese], [in Japanese]

Pages 269-272
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_269

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (713K)
Comparison of Interface Formation Phenomena by Nanoporous Structure Using Different Metals

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 273-276
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_273

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (836K)
High-performance silver alloy bonding wire for memory devices

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 277-280
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_277

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (705K)
Copper Metallization on Glass Substrate with TGV

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 281-284
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_281

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1236K)
Copper Pattern Formation by Modified Semi-Additive Process using Silver Nano-particles Seed Layer

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 285-288
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_285

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (544K)
Evaluation of Fine Patterned Silicon Throug Silicon Via using Scanning Laser Beam Induced Current

[in Japanese], [in Japanese]

Pages 289-292
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_289

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (684K)
Development of 2.5D type high density organic package substrate

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 293-296
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_293

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (724K)
Development of Long and High-Density Flexible Printed Circuit for Nuclear Physics Experiments

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 297-300
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_297

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (740K)
[title in Japanese]

[in Japanese]

Pages 301-306
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_301

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (2847K)
Behavior Sensing using Shoes Equipped with Small Sensor Module

[in Japanese], [in Japanese], [in Japanese]

Pages 307-310
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_307

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (612K)
Low Temperature Atomic Vapor Cell Fabrication Process for Chip Scale Atomic Clocks

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 311-314
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_311

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (818K)
Improvement of Object Identification Method in Automatic Tracking System

[in Japanese]

Pages 315-318
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_315

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (563K)
Microfabrication of PTFE using X-ray-induced pyrochemical etching

[in Japanese], [in Japanese], [in Japanese]

Pages 319-322
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_319

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (951K)
Investigation on the practical needle-type wearable Na sensor

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 323-326
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_323

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1267K)
Analysis of High-Frequency Response Characteristics of InGaAs HEMTs under Irradiation with DC Light at a Wavelength of 1480 nm

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 327-330
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_327

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (904K)
Microwave Power Transfer Technology for sensors

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 331-334
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_331

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (806K)
Conductor Loss Analysis in PWB Using Surface Conductivity Measurement and 3D Electromagnetic Simulation

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 335-338
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_335

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (980K)
EVALUATION OF ELECTRICAL CHARACTERISTICS OF PRINTED ORGANIC THIN-FILM TRANSISTOR UNDER UNIAXIAL TENSILE LOAD

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 339-342
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_339

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (3109K)
Evaluation of Mechanical Properties and Insulation Performance of Polyparaxylene Under Tensile Load

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 343-346
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_343

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (3670K)
Analysis of Electrical Conductivity Variations of Stretchable Wires Printed Using a Polyurethane-based Conductive Paste during Cyclic Tensile Tests

[in Japanese], [in Japanese]

Pages 347-350
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_347

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (569K)
Fabrication of Three-Dimensional Inkjet Printed Interconnects with High Adhesion to Plastic Substrate by Continuous Wave Xenon Photo-Sintering

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 351-354
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_351

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (835K)
Fabrication of Touch Sensors on Surfaces of Three-Dimensional Soft Object by Using Omnidirectional Inkjet Printing Technology

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 355-358
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_355

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (758K)
FABRICATION OF HIGH-PERFORMANCE ALL-SOLID-STATE FLEXIBLE AND STRETCHABLE SUPERCAPACITORS

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 359-362
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_359

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (343K)
Development of Environmentally-Friendly PWB Publication Method Without Chemical-Etching Process -5-

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 363-366
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_363

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (725K)
Development of a chucking assist sheet to fix film substrates during vacuum suction

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 367-370
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_367

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (895K)
Fabrication of Ag Electrode by Patterning of Ag Nanoink on Silicon Substrate: Characterization of the Ag/Si Schottky Contacts

[in Japanese], [in Japanese], [in Japanese]

Pages 371-374
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_371

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (760K)
Improvement of Electrochemical Migration Resistance in Printed Silver Electrodes

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 375-378
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_375

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (653K)
Development of New Electronic Connecting Technology by using Soft Blanket Gravure Printing Technology and Application for Fabrication of FPCs for Circuits on Curved Surfaces

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 379-382
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_379

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (675K)
Development of Insulating Inks and Soft Blanket Reverse Offset Printing Technology with the Inks onto Curved Surfaces

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 383-386
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_383

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (567K)
Formation of Conductive Patterns on Low Heat-resistance Substrates Using Copper Nano Ink

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 387-390
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_387

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (831K)
Reducing environmental impacts for Dry Film Resist stripping process

[in Japanese], [in Japanese], [in Japanese]

Pages 391-392
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_391

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (614K)
Development of bonding technology centering on aluminum by new silver nanoparticle paste

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Pages 393-394
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_393

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (611K)
PCB Depaneling Equipment and PCB Prototyping Equipment

[in Japanese]

Pages 395-396
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_395

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (367K)
Plug-in tool for Design For Test checks directly on schematic diagram during the schematic capture stage to improve test coverage

[in Japanese]

Pages 397-398
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_397

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (556K)
Introduction of Next-Generation Design Tools such as Electro-Mechanical Integrated, FO-WLP, MID

[in Japanese], [in Japanese], [in Japanese]

Pages 399-400
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_399

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (462K)
Advanced Metal mask For Printable Electronics

[in Japanese]

Pages 401-402
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_401

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (656K)
The low temperature and the short-time hardening adhesives for electronic device mounting

[in Japanese], [in Japanese], [in Japanese]

Pages 403-404
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_403

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (750K)
Capillary Coater for round substrate

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Pages 405-406
Published: 2018
Released on J-STAGE: October 18, 2019

DOIhttps://doi.org/10.11486/mes.28.0_405

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (410K)

Register with J-STAGE for free!