Poly (amide-imides) (PAI) and poly (amic-acids) (PAA), soluble in tetrahydrofuran (THF), were synthesized in order to establish the measuring method of molecular weight distribution for heat-resistant resins such as polyimides by size exclusion chromatography (SEC). The chromatogram patterns of these resins were investigated under the different eluents and packing materials, respectively.
PAI-B, synthesized from 2, 2-bis [4- (4-aminophenoxy) phenyl] propane (BAP) and trimellitic anhydride acid chloride (TAC), and PAA-B, synthesized from BAP and pyromellitic dianhydride (PMA), which were soluble in THF, were used for SEC. In SEC using styrene- divinylbenzene copolymer gel (S-column), the reproducibility of SEC chromatograms of PAI-B and PAA-B are well in using the mixture of dimethylformamide (DMF) and THF (D/T) with LiBr and H₃PO₄ for eluent (Fig.4b) to suppress the dissociation of the resins into an eluent and the adsorption of them to a packing material. In this system, it is found that the SEC chromatograms of these resins are also normal when the eluent converts D/T with additives to THF without additives (Fig. 3). Furthermore, the reproducibility of chromatograms are well when the column converts S-column to hydrophilic acrylate gel column (A-column) (Fig. 7a).
From these results, it is confirmed that the elution patterns concerning with PAI and PAA in SEC depend on the interaction of sample, packing material and eluent, especially influenced by the interaction of sample and packing materials greatly.

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Photosensitive polyimide coatings are being used as interdielectrics and protection coatings of electronic devices. They can easily give finely patterned films by photolithographic procedure with excellent characteristics of polyimides.
Photosensitive polyimides are polyimides or polyimide precursors with photosensitive groups and can be converted to polyimides by heat curing. Photosensitive groups like double bonds or azides are incorporated to polymer chain through covalent bonds or acid-amine salts. Some polyimides have photosensitivity even without photosensitive groups.
They are used as interdielectrics or protection coatings of semiconductor devices, LSI assembly packages or other electronic devices such as linephotosensors.
In this paper, photosensitive polyimides, their characteristics, pattern generation processes and applications are reviewed.

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Plasma polymerization to make organic coatings has become an important practical technique for the deposition of pinhole- free conformable thin films with superior physical, chemical, mechanical, electrical and electronical properties. The purpose of this paper is to briefly review basic principle and method of polymerization and to introduce the structure of plasma polymerization analyzed by various methods. Recently, plasma polymerization of metal-containing compounds has been attracted considerable attention since the metals incorporated in organic thin films can dramatically influence on the physical, chemical and electrical properties of the resulting films and the recent progress of this field will also be described.

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First in chapter 1 the article on the urea- formaldehyde condensates by H. Scheibler, F.Trostler and E.Scholz (1928), next in chapter 2 the article by Bois de Chesne (1932) and then in chapter 3 the article by H. Fahrenhorst (1955) are introduced. These authors reacted urea with formaldehyde in different solvents i.e. acetic acid, water and butanol and reached different conclusions. In chapter 4 the reactions of dimethylol-urea with phenols were investigated, introducing the articles by R. W. Martin (1952), H. de Diesbach (1931), H. v. Euler (1941) and G. Zigeuner (1955). In conclusion the behavior of NH-CH₂ bond is analogous to the active center (H₂C-NH-CH₂) of the ammonia-resols, which is postulated by T. Shono (1929) and E. Imoto (1949).

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