Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Papers
Study on Accelerated Additive Consumption by the Use of Insoluble Anode in Acid Copper Plating
Hideki HagiwaraYasuhiro OgoKumiko IshikawaRyoichi Kimizuka
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2009 Volume 12 Issue 6 Pages 551-556

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Abstract
It is widely known that the use of insoluble anodes result in a greater quantity of additive consumption than phosphorised copper anodes. Consequently, the insoluble anode is covered with a permeable membrane in use, but recently, insoluble anodes that do not cause considerable additive consumption without permeable membrane have been reported. This paper reports on the result of our study on the cause of substantial additive consumption that results from the use of insoluble anodes. As a result of the study, it is clearly suggested that in the acid copper plating bath containing chloride ions, hypochlorite is generated at the surface of the insoluble anode by the chloride oxidation reaction, and the hypochlorite decompose the additives by oxidation.
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© 2009 The Japan Institute of Electronics Packaging
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