Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Materials & Process Technologies
Copper Sulfate Plating Technology for Filling for the Next Generation Electronic Circuit Boards
Takuro Sato, Hideki Hagiwara, Nobuo Sakagawa, Hiroshi Ishizuka, Yasuhiro Ogo, Yuto Oyama
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2010 Volume 13 Issue 5 Pages 375-378

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals
Transactions of The Japan Institute of Electronics Packaging
Proceedings of JIEP Annual Meeting
Proceedings of Microelectronics Symposium
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