Journal of The Japan Institute of Electronics Packaging

All issues

Predecessor

Volume 13, Issue 5

Displaying 1-28 of 28 articles from this issue

Download citation

Show all abstracts

Preface

Have an Impression toward “Monozukuri”

Takeshi Bessho

Article type: Preface
2010 Volume 13 Issue 5 Pages P5
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.P5

JOURNAL FREE ACCESS

Download PDF (199K)

Special Articles: Electronic Circuit Boards for Next Generation

(Title page)

2010 Volume 13 Issue 5 Pages 317
Published: 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.317

JOURNAL FREE ACCESS

Download PDF (18K)
Intention to the Special Edition

Masami Shibata

Article type: Special Articles / Electronic Circuit Boards for Next Generation
2010 Volume 13 Issue 5 Pages 318
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.318

JOURNAL FREE ACCESS

Download PDF (133K)

Reviews

Challenge of Promising Technologies for the Next Generation Packaging

Yutaka Tsukada

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Reviews
2010 Volume 13 Issue 5 Pages 319-326
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.319

JOURNAL FREE ACCESS

Download PDF (2797K)
Roadmap of LSI Packages and Requirements to Circuit Board

Ryo Haruta

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Reviews
2010 Volume 13 Issue 5 Pages 327-333
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.327

JOURNAL FREE ACCESS

Download PDF (1358K)
Trend of Automotive Electronics and Improvement in PCB

Arihiro Kamiya

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Reviews
2010 Volume 13 Issue 5 Pages 334-339
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.334

JOURNAL FREE ACCESS

Download PDF (3369K)

Electronic Circuit Board Technologies

Technology of High Density Build-Up Printed Wiring Board

Toshihisa Uehara

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Electronic Circuit Board Technologies
2010 Volume 13 Issue 5 Pages 340-344
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.340

JOURNAL FREE ACCESS

Download PDF (2909K)
The Current Status and Perspective of COF Tape for Large Scale LCD

Akira Chinda

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Electronic Circuit Board Technologies
2010 Volume 13 Issue 5 Pages 345-350
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.345

JOURNAL FREE ACCESS

Download PDF (1666K)
Embedded Passive and Active Devices Technologies

Yoshitaka Fukuoka, Kenji Sasaoka, Masaya Tanaka, Hidetsugu Sagara, Osa ...

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Electronic Circuit Board Technologies
2010 Volume 13 Issue 5 Pages 351-357
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.351

JOURNAL FREE ACCESS

Download PDF (3016K)
A Novel Dual Face Package (DFP) and Its Application

Masamichi Ishihara, Shigenori Sawachi

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Electronic Circuit Board Technologies
2010 Volume 13 Issue 5 Pages 358-362
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.358

JOURNAL FREE ACCESS

Download PDF (2676K)

Materials & Process Technologies

High Heat-Resistant, Low Dielectric Multi-layer Circuit Board Materials

Masao Imai, Hiroyuki Fujisawa, Hiroki Tamiya, Tatsuo Yonemoto

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 363-366
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.363

JOURNAL FREE ACCESS

Download PDF (772K)
New Low-CTE and High-Modulus Materials for Next Generation Application

Shin Takanezawa, Hikari Murai, Masato Miyatake, Tomohiko Kotake, Masaa ...

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 367-370
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.367

JOURNAL FREE ACCESS

Download PDF (1122K)
The Advent of Non-Etching Adhesion Promoters Use within the Printed Circuit Board Industry

Roger Massey, Koichiro Terauchi

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 371-374
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.371

JOURNAL FREE ACCESS

Download PDF (1619K)
Copper Sulfate Plating Technology for Filling for the Next Generation Electronic Circuit Boards

Takuro Sato, Hideki Hagiwara, Nobuo Sakagawa, Hiroshi Ishizuka, Yasuhi ...

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 375-378
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.375

JOURNAL FREE ACCESS

Download PDF (1409K)
Via Filling Technology with Acid Copper Plating for Next Generation Electronic Circuit Board

Shingo Nishiki

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 379-382
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.379

JOURNAL FREE ACCESS

Download PDF (479K)
Process of Plating for Smooth Circuit Formation on Various Materials

Mitsuhiro Watanabe, Masaharu Sugimoto, Hideo Honma

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 383-387
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.383

JOURNAL FREE ACCESS

Download PDF (3158K)
Photosensitive Dry Film for High-Density Semiconductor Package Substrate

Masaki Endo

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 388-391
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.388

JOURNAL FREE ACCESS

Download PDF (2601K)
Super Fine Pattern Etching System

Kimihiko Ikeda, Ryoji Kabeya

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 392-395
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.392

JOURNAL FREE ACCESS

Download PDF (3883K)
Solder Resist for Next-Generation Electric Circuit Board

Masao Arima

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 396-399
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.396

JOURNAL FREE ACCESS

Download PDF (1406K)
Progress of Gold-Plating Technology “Protecting Agent” for Semiconductor Package

Ryuji Takasaki, Yoshizou Kiyohara, Kenji Yoshiba

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Materials & Process Technologies
2010 Volume 13 Issue 5 Pages 400-404
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.400

JOURNAL FREE ACCESS

Download PDF (1637K)

Manufacturing Equipment Technologies

Laser Drilling Technology for the Next Generation Printed Circuit Board

Osamu Kuze

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Manufacturing Equipment Technologies
2010 Volume 13 Issue 5 Pages 405-408
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.405

JOURNAL FREE ACCESS

Download PDF (1690K)
Direct Imaging Technology for Next Generation Packaging

Akira Irie, Takeshi Oguro

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Manufacturing Equipment Technologies
2010 Volume 13 Issue 5 Pages 409-412
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.409

JOURNAL FREE ACCESS

Download PDF (1480K)

Reliability Technologies

Significance of Via Reliability for Printed Wiring Board

Akihiko Happoya

Article type: Special Articles / Electronic Circuit Boards for Next Generation
Subject area: Reliability Technologies
2010 Volume 13 Issue 5 Pages 413-417
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.413

JOURNAL FREE ACCESS

Download PDF (1247K)

News

2010 Volume 13 Issue 5 Pages 418-420
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.418

JOURNAL FREE ACCESS

Download PDF (265K)
Errata: Report of the 15th General Meeting of Japan Institute of Electronics Packaging
[J. Jpn. Inst. Electron. Packaging 13(4): 295-311 (2010)]

Article type: Errata
2010 Volume 13 Issue 5 Pages 419
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.419

JOURNAL FREE ACCESS

Download PDF (233K)
Announcement

2010 Volume 13 Issue 5 Pages A51
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.A51

JOURNAL FREE ACCESS

Download PDF (688K)
Contents (in Japanese)

2010 Volume 13 Issue 5 Pages C51
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.C51

JOURNAL FREE ACCESS

Download PDF (135K)
Contents (in English)

2010 Volume 13 Issue 5 Pages C52
Published: August 01, 2010
Released on J-STAGE: April 30, 2011

DOIhttps://doi.org/10.5104/jiep.13.C52

JOURNAL FREE ACCESS

Download PDF (62K)

Register with J-STAGE for free!