Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Packaging Technology
A High Density Embedded Technologies with Thermoplastics and Powder Metallurgy
Kouji Kondo
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2011 Volume 14 Issue 5 Pages 413-417

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© 2011 The Japan Institute of Electronics Packaging
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