Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Packaging Technology
Overview and Future of 3D Package
Shigekazu Hino, Kikuo Wada
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2011 Volume 14 Issue 5 Pages 418-421

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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