Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
Electroless Pattern Copper Plating on PET Film Using Nano-Dispersion of Polypyrrole
Hiroki AshizawaShin-ichiro KatoYosuke Nakamura
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2013 Volume 16 Issue 2 Pages 152-158

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Abstract
We studied electroless copper plating with a nanodispersion of polypyrrole using the loss of oxidation-reduction ability of polypyrrole by UV irradiation as a method of pattern plating on PET film. Using this method, palladium catalysts are only adsorbed onto the polypyrrole sites where there is no UV irradiation, resulting in the formation of pattern plating. Examining the irradiation conditions indicates that UV irradiation with wavelengths shorter than 300 nm is effective for the degradation of polypyrrole and copper was not deposited when the polypyrrole surface resistivity is higher than 1012 Ω/□. In pattern UV-irradiation for polypyrrole, the introduction of a reduction process where palladium ions (Pd2+) are reduced to zero-valent palladium (Pd) after catalyzing removed a small amount of residual palladium at the UV-irradiation sites and then allowed suitable pattern plating. In summary, this method can easily accomplish direct pattern plating on PET films.
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© 2013 The Japan Institute of Electronics Packaging
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