Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
Debonding Criterion for Single Lap Joints from the Intensity of Singular Stress Field
Tatsujiro MiyazakiNao-Aki NodaRong LiTakumi UchikobaYoshikazu Sano
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2013 Volume 16 Issue 2 Pages 143-151

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Abstract
In this study, adhesive strength is newly considered in terms of the singular stress appearing at the end of the interface between the adhesive and the adherent. Here the critical intensity of the singular stress is examined as the debonding criterion for all types of single lap joints having different adhesive thickness and overlap length. The intensity of the singular stress can be evaluated by the application of the finite element method focusing on the stress value at the end element of the interface. It should be noted that, except for the case of small overlap length, the separation always occurs at the edge of the interface causing unstable growth and final brittle fracture. In this type of fracture, it is found that the critical intensity of the stress singular field is constant independent of the adhesive thickness and overlap length.
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© 2013 The Japan Institute of Electronics Packaging
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