Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
State-of-the-Art in Electronics
Technical Trend of Packaging for Power Semiconductor Modules
Yoshikazu Takahashi, Akira Morozumi, Yoshinari Ikeda, Yoshitaka Nishimura
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2013 Volume 16 Issue 5 Pages 341-346

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