Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Trends and Anticipation of Device Embedding
Circumstances of Developing Device Embedded Substrate and Its Future Subjects
Katsumi Miyama
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2014 Volume 17 Issue 5 Pages 342-347

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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