Bonding Tecnology for Embedded Package

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Jisso and Inspection Technologies

Bonding Tecnology for Embedded Package

Yoshiyuki Arai

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JOURNAL FREE ACCESS

2014 Volume 17 Issue 5 Pages 414-417

DOI https://doi.org/10.5104/jiep.17.414

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© 2014 The Japan Institute of Electronics Packaging

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Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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