Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Technical Paper
A Study of Defect Inspection System for Minute Printed Wiring Boards by Using Capacitance Type Sensor —The Second Report Non-Contact Imaging by Probe Scanning—
Masanori NoguchiYukio SaitoOkitoshi TsunodaHideo Tomita
Author information
JOURNAL FREE ACCESS

2015 Volume 18 Issue 2 Pages 118-123

Details
Abstract
This paper discusses a capacitance probe that allows us to visualize wiring patterns on PCB without contacting the board directly.
We developed a positioning control mechanism that operates in three dimensions with 5 μm accuracy. Then, we used that system to move a capacitance probe precisely along the PCB surface.
We used the system to visualize wiring patterns using the capacitance change of the PCB surface. The system was able to make an image of 200 μm wide patterns in the non-contact condition. This shows the possibility of an inspection method that visualizes the wiring patterns on a PCB in a non-contact condition using a capacitance probe.
Content from these authors
© 2015 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top