Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

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Predecessor

Volume 18, Issue 2

Displaying 1-15 of 15 articles from this issue

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Preface

The Stream of Printed Wiring Board Industry

Mitsuaki Toda

2015 Volume 18 Issue 2 Pages P2
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.P2

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Special Articles / Recent Researches of Thermal Management in Electronics

Introduction to the Special Edition

Tomoyuki Hatakeyama

2015 Volume 18 Issue 2 Pages 85
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.85

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Recent Studies on Thermal Design of Fan Cooled Electronic Equipment

Takashi Fukue

2015 Volume 18 Issue 2 Pages 86-93
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.86

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Cooling Technology for the Next Generation SiC On-Vehicle Inverters

Kazuhisa Yuki

2015 Volume 18 Issue 2 Pages 94-99
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.94

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Thermal Simulation Techniques for the Design of Power Electronics Equipment

Katsuhiro Koizumi

2015 Volume 18 Issue 2 Pages 100-103
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.100

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Pre-Applied Inter Chip Fill for 3D-IC

Yasuhiro Kawase, Hideki Kiritani

2015 Volume 18 Issue 2 Pages 104-107
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.104

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Temperature Prediction with Two-Resistor Model and Consideration of The Cause of Its Prediction Error

Koji Nishi

2015 Volume 18 Issue 2 Pages 108-112
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.108

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Proposal of New Thermal Management Method for Surface Mount Resistors Adapting to Change of Mounting and Heat Dissipation Configuration

Koichi Hirasawa

2015 Volume 18 Issue 2 Pages 113-117
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.113

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Technical Paper

A Study of Defect Inspection System for Minute Printed Wiring Boards by Using Capacitance Type Sensor —The Second Report Non-Contact Imaging by Probe Scanning—

Masanori Noguchi, Yukio Saito, Okitoshi Tsunoda, Hideo Tomita

2015 Volume 18 Issue 2 Pages 118-123
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.118

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This paper discusses a capacitance probe that allows us to visualize wiring patterns on PCB without contacting the board directly.
We developed a positioning control mechanism that operates in three dimensions with 5 μm accuracy. Then, we used that system to move a capacitance probe precisely along the PCB surface.
We used the system to visualize wiring patterns using the capacitance change of the PCB surface. The system was able to make an image of 200 μm wide patterns in the non-contact condition. This shows the possibility of an inspection method that visualizes the wiring patterns on a PCB in a non-contact condition using a capacitance probe.

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Report

Hitachi Chemical Co., Ltd, Advanced Performance Materials Operational Headquarters, Packaging Solution Center

Keiichi Hatakeyama

2015 Volume 18 Issue 2 Pages 124
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.124

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Report

2014 Workshop

[in Japanese]

2015 Volume 18 Issue 2 Pages 125-126
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.125

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Announcement, Contents, etc.

News

2015 Volume 18 Issue 2 Pages 127-128
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.127

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Announcement

2015 Volume 18 Issue 2 Pages A21-
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.A21

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Contents

2015 Volume 18 Issue 2 Pages C21
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.C21

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Contents (in English)

2015 Volume 18 Issue 2 Pages C22
Published: 2015
Released on J-STAGE: June 01, 2015

DOIhttps://doi.org/10.5104/jiep.18.C22

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