2.1D, 2.5D IC集積の最新技術動向

Journal of The Japan Institute of Electronics Packaging

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

Special Articles / Latest Trends in 2.1D/2.5D IC Packaging Technologies

Latest Technology Trends on 2.1D, 2.5D IC Integration

Henry H. UTSUNOMIIYA

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JOURNAL FREE ACCESS

2015 Volume 18 Issue 3 Pages 137-142

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[in Japanese]

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